Call for Abstract Extended Deadline:
Abstract Submission Guidelines
Please review Steps 1-5 below before entering the online abstract submission site.
Step 1
Before signing up or logging into the online system (in Step 5), please review all of the following steps to ensure you have the information needed to complete the abstract submission process.
Please Note the Following Requirements Prior to Submission:
- If you are planning to submit multiple abstracts, presenters are limited to one oral and one poster presentation.
Step 2
Select a topic from the list below.
Step 3
Fill out the abstract content and author details in the system (abstract 2,700 characters max. including grammar and spacing; you may also submit a supplemental 1 page PDF file containing any graphs, charts or pictures you wish to include).
Step 4
Agree to the copyright agreement. If you have questions e-mail yvonne@avs.org.
STEP 5
Opens February 8
Author Notification
Acknowledgment that your abstract has been submitted will follow by e-mail shortly after submission. Notifications regarding acceptances will be sent by e-mail by Mid-July.
Topics
2D Materials (2D)
- 2D1+AP+EM+PS+SS+TF: 2D Materials Growth and Fabrication
- 2D2+MI: Electron Microscopy and Spectroscopy of 2D Materials
- 2D3+HC+MN+NS+SS: Scanning Probe Microscopy and Spectroscopy of 2D Materials
- 2D4+EM+HC+NS+QS+TF: Dopants, Defects, and Edges in 2D Materials
- 2D5: Optical and Valley Properties of 2D Materials
- 2D6+EM+MN+NS+QS: Electromechanical and Optoelectronic Properties in 2D Materials
- 2D7+EM+NS+PS+QS: Properties of Layered 2D Materials, including Heterostructures and Twistronics
- 2D8+MI+NS+QS: Correlated Properties in 2D Materials, including Magnetism, Charge Density Waves, and Superconductivity
- 2D9+EM+LD+SS: Electronic and Vibrational Properties in 2D Materials and Heterostructures for Device Applications
- 2D10+AP+BI+HC+NS+PS+SS+TF: Adsorption and Functionalization on 2D Materials
- 2D11+BI+LD+MN+PS+SS+TF: 2D Materials for Electrochemical, Energy, and Environmental Applications
- 2D12+EM+MI+SS: 2D Materials Theory, Computation, and Materials Discovery
- 2D13: 2D Materials Poster Session
Actinides and Rare Earths (AC)
- AC1+LS+MI: Magnetism, Electron Correlation, and Superconductivity in the Actinides and Rare Earths
- AC2+AS: Chemistry and Physics of the Actinides and Rare Earths
- AC3+AS+LS: Forensics
- AC4+LS+MI: Actinide and Rare Earth Theory
- AC5+LS: New Experimental Approaches
- AC6+LS: Early Career Scientists
- AC7: Actinides and Rare Earths Poster Session
Advanced Ion Microscopy & Ion Beam Nano-Engineering (HI)
- HI1: Advanced Ion Microscopy & Surface Analysis Applications
- HI2: Novel Beam Induced Material Engineering & Nano patterning
- HI3: Emerging Ion Sources, Optics, and Applications
- HI4: Advanced Ion Microscopy & Nano-Engineering Poster Session
Advanced Surface Engineering (SE)
- SE1: Vapor Deposition and HiPIMS in Surface Engineering
- SE2: Nanostructured and Multifunctional Thin Films and Coatings
- SE3: Mechanical and Tribological properties/Characterization of Thin Films and Coatings
- SE4: New Trends and Industrial Applications in Surface Engineering
- SE5: Advanced Surface Engineering Poster Session
Applied Surface Science (AS)
- AS1+BI+CA+LS: Quantitative Surface Analysis
- AS2+BI+CA+LS+NS+SE+SS: Analysis of Surfaces and Interfaces Related to Energy and the Environment
- AS3+AC+BI+CA: Getting the Most out of your Analysis using Complimentary Techniques
- AS4+HC+PS+SE+SM: Modification of Surfaces and Interfaces for Practical Applications
- AS5+AC+BI+SS: Applied Surface Science and Data Processing
- AS6+BI: Combining Depth Profiling with Surface Analysis
- AS7: Charles S. Fadley Memorial Session (ALL INVITED SESSION)
- AS8: Applied Surface Science Division Poster Session
Atomic Scale Processing (AP)
- AP1+2D+EM+MN+PS+TF: Area Selective Processing and Patterning
- AP2+EL+MS+NS+SS+TF: Advancing Metrology and Characterization to Enable Atomic Scale Processing
- AP3+2D+MN+PS+TF: Atomic Layer Processing: Integration Of Deposition And Etching For Advanced Material Processing
- AP4+PS+SS+TF: Beam Studies/Surface Reaction Analysis and Emerging Applications of Atomic Scale Processing
- AP5+PS+TF: Thermal Atomic Layer Etching
- AP6: Atomic Scale Processing Poster Session
Biomaterial Interfaces (BI)
- BI1: Microbes and Fouling at Surfaces
- BI2: Biomolecules and Biophysics at Interfaces
- BI3: Characterization of Biological and Biomaterials Surfaces
- BI4: Bioanalytics and Diagnostics
- BI5+NS: Biomaterials and Nanomaterials Fabrication
- BI6: 3D Structures and 3D Analysis of Biomaterials
- BI7: Simulation and Modeling of Biomaterials and Biosystems
- BI8: High-Resolution Microscopy of Biosystems and Biomaterials
- BI9: In situ Characterization of Biomaterials
- BI10: Bioelectronics and Biosensing
- BI11: Bioenergy and Biomass Conversion
- BI12: Matter-to-Life I Synthetic and Programmable Cells
- BI13: Matter-to-Life II Synthetic Life at the Nanoscale
- BI14: Matter-to-Life III the Route to Replication
- BI15: Biomaterial Interfaces Poster & Flash Session
Biomaterial Plenary (BP)
- BP1: Biomaterials Plenary Session: Materials and Biology for the Future of Energy and the Environment
Chemical Analysis and Imaging at Interfaces (CA)
- CA1+AS+LS+MN+SS+VT: Environmental Interfaces
- CA2+2D+AS+BI+HC+LS+MN+NS+SM+SS: In situ Microscopy, Spectroscopy and processing at Liquid-Solid-Gas Interfaces
- CA3+HC+LS+MN+SS+VT: Multiphase Interfacial Analysis and Imaging
- CA4+AS+BI+MN+SM: Modeling and Multi-dimensional data processing of interfacial processes
- CA5+AS+MN+SE+SM+SS: Progress and Challenges in Industrial Applications
- CA6+2D+AS+MN+SE+SM+SS: Novel Developments and Approaches of Interfacial Analysis
- CA7: Chemical Analysis and Imaging at Interfaces Poster Session
Electronic Materials and Photonics (EM)
- EM1+BI+NS+PS+TF: Electronic and Photonic Materials and Devices
- EM2+PS+TF: New Devices and Materials for Logic, Memory, and Interconnects
- EM3+TF: Wide and Ultra-wide bandgap materials and devices
- EM4+BI+MI+MN+NS: Bottom-up Nanostructures
- EM5+MI: Electronic and Photonic Devices for Energy Conversion and Storage
- EM6+MN: 2.5 and 3D Heterogeneous Integration
- EM7+PS+TF: Atomic Scale Processing for Devices
- EM8+TF: Accelerated Materials and Device Discovery: Simulation and Modeling
- EM9: Electronic Materials and Photonics Poster Session
Exhibitor Technology Spotlight Workshops (EW)
- EW1: Exhibitor Technology Spotlight Session
Fundamental Discoveries in Heterogeneous Catalysis (HC)
- HC1+SS: Mechanisms and Reaction Pathways in Heterogeneously-Catalyzed Reactions
- HC2+2D+NS+SS+TF: Nanoparticles and Nanoscale Structures in Heterogeneous Catalysis
- HC3+SS: Utilization of Theoretical Models, Machine Learning, and Artificial Intelligence for Heterogeneously-Catalyzed Reactions
- HC4+SS: Bridging Gaps in Heterogeneous Catalysis
- HC5+AS+CA+LS+SS: Ambient Pressure Studies of Heterogeneous Catalysis
- HC6+SS: Advances in Heterogeneous Electrocatalysis
- HC7+SS: Single Atom Catalysis
- HC8: Fundamental Discoveries in Heterogeneous Catalysis Poster Session
Leaders in Energy and The Environment (LD)
- LD1+HC+SS: Catalysis at the Metal Oxide Interface
- LD2+NS: Pushing the Boundaries of Energy Transfer in Materials
- LD3+2D+NS+SS: Advanced Materials for Electronic and Environmental Applications
- LD4: Leaders in Energy and the Environment Poster Session
Magnetic Interfaces and Nanostructures (MI)
- MI1: Topological Insulator Heterostructures
- MI2: Spin Landscape I: Magnetic Structures in Real and Momentum Space
- MI3: Spin Landscape II: Magnetic Structures for Energy-Efficient Computing/Devices
- MI4: Mini Symposium: Highlighting Women Researching Magnetism
- MI5: Magnetic Interfaces and Nanostructures Poster Session
Manufacturing Science and Technology (MS)
- MS1+AP+NS+TF: Science and Technology for Atomically Precise Manufacturing
- MS2+AP+EM+NS+QS+TF: Science and Technology of Manufacturing for Quantum Computing
- MS3+AP: Science and Technology of manufacturing AI Hardware
- MS4: Manufacturing Science and Technology Poster Session
Materials and Processes for Quantum Information Science (QS)
- QS1+EM+MN: Systems and Devices for Quantum Information
- QS2+EM+SS: Systems and Devices for Quantum Computing
- QS3+EM+SS: High Coherence Qubits for Quantum Science
- QS4+2D+EM+MN: SiC, Diamond and Related Materials for Quantum Sciences
- QS5+EM+MN: The Quantum Metrology Revolution
- QS6+EM+VT: Color Centers: From Materials to Quantum Technologies
- QS7+EM: Materials and Processes for Quantum Information Science Poster Session
MEMS and NEMS Technology (MN)
- MN1+BI+EM: MEMS Technology for Energy and Environment
- MN2+2D+SE+SS: Nanotribology and Nanomechanics at the Interface
- MN3+2D+NS+QS: MEMS & NEMS Enabled Sensing & Imaging
- MN4+2D+NS+QS: Nanomechanics and Optomechanics for Quantum Computing and Sensing
- MN5+AP+BI+EM+NS+PS+SE+TF: MEMS and BioMEMS Processes, Materials, and Devices
- MN6: MEMS and NEMS Heterogeneous Integration
Nanoscale Science and Technology (NS)
- NS1+AS+BI+EM+LD+SS: Scanning Probe Microscopy and Spectroscopy for Energy and Environment
- NS2+MI+QS+SS: Quantum States at Surfaces
- NS3+MN+QS+SM+SS: Nanomechanics – Including Nanoscale-Dependent Materials’ Properties and Quantum Effects
- NS4+AP+BI+SS: Advances in Scanning Probe Technologies
- NS5+BI+SS+TF: Emergent Properties of Nanostructured Surfaces: from Metasurfaces to Superhydrophobic
- NS6+MI: Energy Efficient Nanoelectronics
- NS7+AP+BI+SM: Nanofabrication
- NS8+SS: Spectroscopic Atomic Force Microscopies for Nanophotonics and Sensing
- NS9: Nanoscale Science and Technology Poster Session
New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources (LS)
- LS1+2D+MI: Magnetism Dichorism and Spin-Resolved Techniques of Magnetic Materials
- LS2+2D+MI+SS: Photoemission spectroscopy Applied to Interfacial Science
- LS3+CA+MI+SE+SS: Microscopy and Imaging Techniques Exploiting Enhance Coherence Properties
- LS4+2D+SS: Structural Characterization of Energy Materials
- LS5: New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources Poster Session
Plasma Science & Technology (PS)
- PS1+EM: Advanced BEOL: Interconnect Materials and Etching
- PS2+EM: Advanced FEOL: Plasma Processing for Logic Devices
- PS3+AP+EM+TF: EUV and Multipatterning: Advanced Packaging, Thermal Management, and Heterogeneous Integration
- PS4+SE: Atmospheric Pressure Plasmas and their Applications
- PS5+AP+EM+TF: Plasma Assisted Atomic Layer Etching
- PS6: Modelling of Plasmas, Plasma-Driven Processes, and Machine Learning
- PS7+AP+TF: Plasma Deposition and ALD Processes for Coatings and Thin Films
- PS8: Plasma Diagnostics, Sensors and Control
- PS9+SE: Plasma Sources
- PS10+AS+BI+EM+SS: Plasma-Surface Interactions
- PS11+AS: Plasma Chemistry and Catalysis
- PS12: Plasmas for Environment: Water, Air, Soil Treatment
- PS13+TF: Plasma-engineered Materials and Interfaces for the Environment
- PS14+TF: Plasma and Plasma-engineered Materials for Energy Savings
- PS15+EM: Plasma Processing for Advanced and Emerging Memory Technologies
- PS16+BI+SM: Plasma for Antimicrobial Treatment, Medicine, and Biointerfaces
- PS17: Plasma Science and Technology Poster Session
Smart Multifunctional Materials for Nanomedicine (SM)
- SM1+AS+BI+CA+MI+SS: Hybrid Nanomaterials Based On Biologically-Inspired Approaches
- SM2+AS+CA+PS+SS: Design and Fabrication of Multifunctional (Nano)materials by Plasma Chemistry (and Their Appropriate Plasma Reactors)
- SM3+BI: Nanomedicine, Theranostics, Wound Healing and Tissue Repair
- SM4: Smart Multifunctional Materials for Nanomedicine Poster Session
Spectroscopic Ellipsometry (EL)
- EL1+TF: Optical Characterization of Thin Films and Nanostructures
- EL2: Spectroscopic Ellipsometry: Novel Applications and Theoretical Approaches
- EL3: Application of SE for the Characterization of Organic Films and Biological Materials
- EL4: Spectroscopic Ellipsometry Poster Session
Surface Science (SS)
- SS1+CA+TF: Dynamics and Mechanisms at Surfaces and Interfaces
- SS2+AS+QS: Artificial Intelligence, Machine Learning, and Quantum Chemistry
- SS3+AS+BI+CA+HC+LD+PS: Environmental and Atmospheric Interfaces
- SS4+CA+HC+NS: Photochemistry and Electrochemistry Surfaces for Energy Applications
- SS5+AP+AS+HC+LD+SE+TF: Reactivity of Oxide and Chalcogenide Surfaces
- SS6+2D+AP+PS+TF: Surface Chemistry of Film Growth and Etching
- SS7+AP+AS+HC+LD+SE+TF: Oxides and Semiconductor Surfaces and Interfaces
- SS8+2D+AP+BI+NS+TF: Molecular Organization at Surfaces
- SS9+SE: Astrochemistry and Surfaces for Space and Extreme Environments
- SS10: Memorial Session in Honor of Patricia Thiel (ALL INVITED SESSION)
- SS11: Surface Science Division Poster Session
Thin Film (TF)
- TF1+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD
- TF2+2D+AP+SS: ALD and CVD: Surface Reactions, Mechanisms, and Kinetics
- TF3+AP+MN+SS: Novel ALD Processes
- TF4+PS+SE: HiPIMS for Emerging and Advanced Materials
- TF5+AP: ALD/CVD Precursors
- TF6+SS: Simulations and Machine Learning Applied to Thin Film Phenomena
- TF7+AP+SS: Nucleation and Interface Phenomena in Thin Film Deposition and ASD
- TF8+SS: Epitaxial Thin Films and Interfaces
- TF9+BI: Solution-based Thin Film Deposition
- TF10+HC+SS: Thin Films for Energy and Catalysis
- TF11+AP+EM+MI: ALD/CVD Thin Films for Integrated Solutions in Advanced Memory Applications
- TF12+EM: Thin Films for Microelectronic Applications
- TF13+EM+MI: Thin Films in Plasmonic, Metamaterials and Photonic Applications
- TF14+EM: Electronic Interfaces and Contacts
- TF15+EM: Thin Films for Emerging Applications: Flexible Electronic, Pyroelectric, Phase Change, and Other Functional Materials
- TF16+BI: Vapor Deposition of Functional Polymer Thin Films
- TF17+BI+EM: Vapor Deposition and Vapor Infiltration for Synthesizing Organic-Inorganic Hybrid Thin Films and Interfaces
- TF18+EM: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials
- TF19+2D+MI: Chalcogenide Materials and Applications
- TF20+2D+EM: Low Dimensional Materials in Tunnelling Applications
- TF21+2D+EM+MI: Thin Films for Quantum Computing
- TF22+AP: ALD and CVD for Nanostructured and High Aspect Ratio Materials
- TF23: Thin Film Poster Session
Undergraduate Poster Session (UN)
- UN1: Undergraduate Poster Session
Vacuum Technology (VT)
- VT1: Vacuum Measurement, Partial Pressure, and Gas Analysis
- VT2: Vacuum Pumping and Extreme High Vacuum
- VT3: Gas Dynamics, Modeling, and Simulation
- VT4: Leaks, Flows, and Material Outgassing
- VT5: Aerospace and Large Vacuum System
- VT6: Vacuum Technology for Accelerators
- VT7: Particle Control, Quality Control, Ultraclean Systems
- VT8: Vacuum Technology for Quantum Applications
- VT9+MI: Next Generation Synchrotron Light Source
- VT10+PS: Vacuum Technology for Fusion Research
- VT11: Vacuum Technology Poster Session