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      • Divisions
        • AS: Applied Surface Science
        • BI: Biomaterial Interfaces
        • EM: Electronic Materials and Photonics
        • MI: Magnetic Interfaces and Nanostructures
        • NS: Nanoscale Science and Technology
        • PS: Plasma Science & Technology
        • SE: Advanced Surface Engineering
        • SS: Surface Science
        • TF: Thin Film
        • VT: Vacuum Technology
      • Focus Topics
        • 2D: 2D Materials
        • AC: Actinides and Rare Earths
        • AP: Atomic Scale Processing
        • CA: Chemical Analysis and Imaging at Interfaces
        • EL: Spectroscopic Ellipsometry
        • HC: Fundamental Discoveries in Heterogeneous Catalysis
        • HI: Advanced Ion Microscopy & Ion Beam Nano-Engineering
        • LD: Leaders in Energy and The Environment
        • LS: New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources
        • QS: Materials and Processes for Quantum Information Science
        • SM: Smart Multifunctional Materials for Nanomedicine
      • Groups
        • MN: MEMS and NEMS Technology
        • MS: Manufacturing Science and Technology
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Division: Plasma Science & Technology (PS)

The Plasma Science & Technology program highlights state-of-the-art advances in plasma science and associated applications, ranging from fundamental studies of plasma physics and chemistry, plasma-matter interactions to new and advanced applications in plasma processing. Our diverse international community includes researchers from academia, national laboratories, and industry covering topics extending from the latest advancements in basic and applied research for established fields such as semiconductor fabrication to novel and emerging applications, where plasma is either the focus or the enabling tool. The program extends over the entire week and includes oral sessions in the morning and afternoon. On Thursday afternoon and Friday morning, there will be two oral session and a poster session on Thursday afternoon. As you peruse this year’s program you will find topics associated with: plasma source development, characterization, and control; modelling of plasmas; machine learning; plasma-matter interactions; the development and use of atmospheric pressure plasmas; plasma chemistry; plasma catalysis; plasmas for the synthesis and treatment of novel materials; plasmas for sustainability; plasmas for biological applications; plasma processing for semiconductor manufacturing; plasma-assisted etching and deposition; and plasmas for atomic scale processing.  Each session includes one or more invited lectures given by a well-recognized subject matter expert along with numerous contributed talks. The program will also feature talks by the PSTD Plasma Prize and Young Investigator Award winners along with student finalists for the Coburn and Winters Award. Our poster session covers all topics noted above in a relaxed environment conducive to extended discussion with the presenters.  In addition, there will be on-demand presentations for those unable to travel due to the global pandemic.

PS-FrM: Plasma Assisted Atomic Layer Etching and Processing for Advanced Memory Technologies

  • Nicole Saulnier, IBM Research Division, Albany, NY, United States Minor Outlying Islands (the), “Plasma Process Requirements for Emerging Memories”
  • Takayoshi Tsutsumi, Nagoya University, Japan, “Virtual Presentation: Control of Interface Layers for Selective Atomic Layer Etching”

PS-MoA: Plasma Chemistry, Catalysis, and Plasma-engineered Materials

  • David Go, University of Notre Dame, “Understanding and Designing Plasma-Catalysis Systems using Experiments and Simulations”
  • Michail Tsampas, DIFFER institute, Netherlands, “Plasma Activated Electrolyser for Nitrogen Fixation by Water”

PS-ThA: Plasma Diagnostics, Sensors and Control

PS-WeA: Advanced FEOL processing, Multi-patterning, and EUV

  • Yohei Ishii, Hitachi High-Tech America, Inc., “2021 AVS PSTD Young Investigator Award Talk: Plasma Treatment on SiGe for Improvement of Interface Trap Density by Inducing Si Segregation”
  • Eric Miller, IBM Research Division, Albany, NY, “Etch Processes for Enabling Next Generation Devices”

PS+AP+TF-ThM: Plasma-assisted Deposition and ALD

  • Silvia Armini, IMEC, Belgium, “Area-Selective Deposition Through Surface Engineering”

PS+EM-WeM: Advanced BEOL Processing

  • Xinghua Sun, TEL Technology Center, America, LLC, “In-Depth Feasibility Study of Dual Damascene Extension: Patterning, Dielectric Etch and Metallization”

PS+SE-FrM: Atmospheric Pressure Plasmas and their Applications

  • Ana Sobota, Eindhoven University of Technology, Netherlands, “Virtual Presentation: Plasma-Substrate Interaction in the Case of Atmospheric Pressure Plasmas”

PS+SE-ThA: Plasma Sources

  • John Chambers, AVS, “Linear Hollow Cathode Plasma Source and the Deposition of Silicon Oxide Materials”

PS3+AP+EM+TF: EUV and Multipatterning: Advanced Packaging, Thermal Management, and Heterogeneous Integration

PS5+AP+EM+TF: Plasma Assisted Atomic Layer Etching

PS-MoM: Modelling of Plasmas, Plasma-Driven Processes, and Machine Learning

  • Anne Bourdon, LPP, CNRS, Ecole Polytechnique, France, “Current Modeling and Simulation Challenges of Low-Temperature Plasmas”

PS1-TuA: Plasma Prize Lectures

  • Jean-Paul Booth, LPP-CNRS, Ecole Polytechnique, France, “2019 Plasma Prize Invited Talk: What We Still Don’t Know About Plasmas in Simple Diatomic Gases- or How to Use a DC Plasma in Pure O2 as Ideal Test-Bed for Experimental Validation of Simulations”
  • Ellen R Fisher, Colorado State University, USA, “2020 Plasma Prize Invited Talk: Optimizing Plasma Processes to Lower Environmental Impact through Understanding Fundamental Plasma Kinetics and Energetics”

PS2-TuA: Plasma Treatments and Processes for the Environment, Ecology and Biology

  • Marcela Bilek, University of Sydney, Australia, “Virtual Presentation: Recent Advances in Plasma Processing for the Creation of Tunable Biofunctional Surfaces and Interfaces”
  • Selma Mededovic Thagard, Clarkson University, “Going Mobile: Design, Optimization, and Scaleup of Plasma Reactors for Treatment of Pfas-Containing Ion Exchange Brine”
  • Floran Peeters, Dutch Institute for Fundamental Energy Research, Netherlands, “Co2 Conversion in Microwave Plasma: Can We Bring It to an Industrial Scale?”

PS+AS+BI+EM+SS-TuM: Plasma-Surface Interactions

  • John Daugherty, Lam Research Corporation, “Plasma-wall Interactions: Implications for Advanced Chamber Materials Requirements”

PS-On Demand: Plasma Science and Technology On Demand Session

PS-ThP: Plasma Science and Technology Poster Session

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Key Dates

Awards Nominations Deadlines:
March 31, 2021
(Student May 3, 2021)

Abstract Submission Deadline:
June 1, 2021
(Late Breaking August 31, 2021)

Early Registration Deadline:
October 4, 2021

Downloads

  • Copyright Agreement (PDF)
  • Presentation Instructions (PDF)
  • Sponsorship Form (PDF)
  • Technical Program (PDF)
  • Viewing Instructions (PDF)

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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