The Plasma Science & Technology program highlights state-of-the-art advances in plasma science, ranging from fundamental studies of plasma physics and chemistry, plasma-matter interactions to new applications for plasma processing. Our diverse international community includes researchers from academia, national laboratories, and industry covering topics extending from the latest advancements in plasma research for established fields such as semiconductor fabrication to newer areas of study such as energy research, novel materials synthesis, catalysis, and biomedical applications, where plasma is either the focus or the enabling tool. Abstracts describing novel research are solicited in areas concerning: Advanced BEOL: Interconnect Materials and Etching; Advanced FEOL: plasma processing for logic devices; EUV and Multipatterning: Advanced Packaging, Thermal Management, and Heterogeneous Integration; Plasma Processing for Advanced and Emerging Memory Technologies; Plasma-assisted Atomic Layer Etching; Plasma Surface Interactions; Plasma Deposition and ALD processes for coatings and thin films; Plasma Diagnostics, Sensors and Control; Plasma Sources; Modelling of plasmas, Plasma-Driven Processes, and Machine Learning; Atmospheric Pressure Plasmas and their applications; Plasma Chemistry and Catalysis; Plasmas for the environment (e.g. water, air, soil treatment); Plasma-engineered materials and interfaces for the environment; Plasma and plasma-engineered materials for energy savings; Plasma for medicine and biointerfaces; Plasma for antimicrobial treatments. We accept abstracts for both oral sessions and poster sessions, which provide an excellent opportunity for one-on-one discussions of new results with colleagues. Special consideration will be given to papers that highlight cross-disciplinary issues of the research. The authors are also encouraged to submit their original results to the accompanying AVS journals.
PS1+EM: Advanced BEOL: Interconnect Materials and Etching
- Suketu Parikh, AMAT- Applied Materials, “Industry Trends in Interconnect Technology”
PS2+EM: Advanced FEOL: Plasma Processing for Logic Devices
- Yohei Ishii, Hitachi High-Tech America, Inc., “2021 AVS PSTD Young Investigator Award Talk: Plasma Treatment on SiGe for Improvement of Interface Trap Density by Inducing Si Segregation”
- Eric Miller, IBM Research Division, Albany, NY, “Etch Processes for Enabling Next Generation Devices”
PS3+AP+EM+TF: EUV and Multipatterning: Advanced Packaging, Thermal Management, and Heterogeneous Integration
- Sophie Thibaut, TEL, “Multipatterning of Immersion and EUV Lithography”
- Rich Wise, Lam Research
PS4+SE: Atmospheric Pressure Plasmas and their Applications
- Ana Sobota, TU Eindhoven, Netherlands, “The Influence of the Target on the Plasma in Atmospheric Pressure Non-Thermal Plasma Jets”
PS5+AP+EM+TF: Plasma Assisted Atomic Layer Etching
- Takayoshi Tsutsumi, Nagoya University, Japan, “Surface Reaction Analysis during Atomic Layer Etching Processes for Si-compound”
PS6: Modelling of Plasmas, Plasma-Driven Processes, and Machine Learning
- Anne Bourdon, Ecole Polytechnique, France, “Current Modeling and Simulation Challenges of Low-Temperature Plasmas”
PS7+AP+TF: Plasma Deposition and ALD Processes for Coatings and Thin Films
- Silvia Armini, IMEC, Belgium
PS8: Plasma Diagnostics, Sensors and Control
- Jean-Paul Booth, CNRS, Ecole Polytechnique, France, “2019 Plasma Prize Invited Talk: What We Still Don’t Know About Plasmas in Simple Diatomic Gases- or How a DC Plasma in Pure O2 Can Be an Ideal Test-Bed for Experimental Validation of Simulations”
PS9+SE: Plasma Sources
- John Chambers, AGC North America, “Linear Hollow-cathode PECVD for High Deposition Rate Coatings and Varied Properties of Deposited Materials”
PS10+AS+BI+EM+SS: Plasma-Surface Interactions
- John Daugherty, Lam Research, “Plasma-wall Interactions: Implications for Advanced Chamber Material Requirements”
PS11+AS: Plasma Chemistry and Catalysis
- David B. Go, University of Notre Dame, “Understanding and Designing Plasma-Catalysis Systems using Experiments and Simulations”
- Michail Tsampas, Dutch Institute for Fundamental Energy, The Netherlands, “Plasma Activated Electrolyser for Nitrogen Fixation by Water”
PS12: Plasmas for Environment: Water, Air, Soil Treatment
- Selma Mededovic, Clarkson University, “Plasma-Induced Formation of Reactive Chlorine Species and Their Effect on Interfacial Kinetics”
PS13+TF: Plasma-engineered Materials and Interfaces for the Environment
- Ellen Fisher, Colorado State University, “”2020 Plasma Prize Invited Talk: Optimizing Plasma Processes to Lower Environmental Impact through Understanding Fundamental Plasma Kinetics and Energetics”
PS14+TF: Plasma and Plasma-engineered Materials for Energy Savings
- Floran Peeters, Dutch Institute for Fundamental Energy Research, “Next Generation “Birkeland-Eyde”: From NH3 to NO”
PS15+EM: Plasma Processing for Advanced and Emerging Memory Technologies
- Nicole Saulnier, IBM, “Plasma Process Requirements for Emerging Memories”
PS16+BI+SM: Plasma for Antimicrobial Treatment, Medicine, and Biointerfaces
- Marcela Bilek, The University of Sydney, Australia, “Recent Advances in Plasma Processing for the Creation of Tunable Biofunctional Surfaces and Interfaces”
- Michael Keidar, The George Washington University, “Cold Atmospheric Plasma Devices for SARS-CoV-2 Disinfection”
PS17: Plasma Science and Technology Poster Session