Call for Abstracts Deadline: May 3, 2021
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    • Focus Topics
      • 2D: 2D Materials
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      • EL: Spectroscopic Ellipsometry
      • HC: Fundamental Discoveries in Heterogeneous Catalysis
      • HI: Advanced Ion Microscopy & Ion Beam Nano-Engineering
      • LD: Leaders in Energy and The Environment
      • LS: New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources
      • QS: Materials and Processes for Quantum Information Science
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Division: Thin Film (TF)

The Thin Film Division offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will cover the breadth of thin film science, thin film interfaces, technology, and applications. We have several  sessions dedicated to ALD and CVD, encompassing from surface reactions and growth mechanisms to novel processes, precursors, scale up, and emerging applications, and sessions dedicated to novel materials by a wide range of deposition processes, including epitaxial films and interfaces, solution based methods, and the application of simulation and machine learning to thin film growth. Additionally, the division has a strong focus on the application of thin films, including  microelectronics and advanced memory applications, interfaces and contacts, flexible electronics, plasmonic, photonic, and metamaterials, energy, and catalysis. It has also a session dedicated to advances in deposition methods of wide bandgap and ultrawide bandgap materials. This year, the division is also introducing two new sessions on thin films for quantum computing and it also features a session on interfacial phenomena in thin film growth. Finally, the division continues its focus on organic and hybrid materials, including the modification of polymers using vapor infiltration methods and the vapor deposition of functional polymer films. As in past years, we will host a student-focused session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TEDTalk” type of forum.

TF1+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD

  • Wei-Min Li, Leadmicro

TF2+2D+AP+SS: ALD and CVD: Surface Reactions, Mechanisms, and Kinetics

  • Rong Chen, Huazhong University of Science and Technology, China, “Inherent Selective Atomic Layer Deposition Strategies and Applications”

TF3+AP+MN+SS: Novel ALD Processes

  • Shi-Jin Ding, Fudan University, China, “Atomic-Layer-Deposited Metal Oxide Semiconductor Films for Electronic Devices”

TF4+PS+SE: HiPIMS for Emerging and Advanced Materials

  • Brian Jurczyk, Starfire Industries LLC
  • David Ruzic, University of Illinois at Urbana-Champaign, “2020 AVS Gaede-Langmuir Award Lecture: How Advances in High-Power Magnetron Impulse Sputtering (HiPIMS) Can Control Ion Energy, Ionization, and have High Deposition Rates”

TF5+AP: ALD/CVD Precursors

  • Won-Jun Lee, Sejong University, Republic of Korea, “Heteroleptic Titanium Precursors for ALD of TiO2 “

TF6+SS: Simulations and Machine Learning Applied to Thin Film Phenomena

TF7+AP+SS: Nucleation and Interface Phenomena in Thin Film Deposition and ASD

  • Mariona Coll, ICMAB – CSIC, Spain, “Novel Metalorganic Precursors for ALD Functional complex Oxide Thin Films”
  • Vincent Vandalon, Eindhoven University of Technology, The Netherlands, “Mechanistic Insight into Atomic Layer Deposition during Initial Growth by In-situ Diagnostics”

TF8+SS: Epitaxial Thin Films and Interfaces

  • Jason Kawasaki, University of Wisconsin – Madison, “Epitaxy, Exfoliation, and Strain-Induced Magnetism in Rippled Heusler Membranes”

TF9+BI: Solution-based Thin Film Deposition

  • Aram Amassian, North Carolina State University, “Solution-based Coating of Next Generation Polycrystalline and Monocrystalline Semiconductors”

TF10+HC+SS: Thin Films for Energy and Catalysis

TF11+AP+EM+MI: ALD/CVD Thin Films for Integrated Solutions in Advanced Memory Applications

TF12+EM: Thin Films for Microelectronic Applications

  • Baratunde Cola, Georgia Institute of Technology, “Progress in Practical Carbon Nanotube Optical Rectenna Development”

TF13+EM+MI: Thin Films in Plasmonic, Metamaterials and Photonic Applications

  • Joshua Caldwell, Vanderbilt University, “Refractive Index Control of IR Light in Highly Anisotropic Media”

TF14+EM: Electronic Interfaces and Contacts

  • Prineha Narang, Harvard University, “Ab Initio Predictions of Electron-Phonon and Phonon-Phonon Interactions and Transport in Quantum Materials”

TF15+EM: Thin Films for Emerging Applications: Flexible Electronic, Pyroelectric, Phase Change, and  Other Functional Materials

TF16+BI: Vapor Deposition of Functional Polymer Thin Films

  • Malancha Gupta, University of Southern California

TF17+BI+EM: Vapor Deposition and Vapor Infiltration for Synthesizing Organic-Inorganic Hybrid Thin Films and Interfaces

  • Tamar Segal-Peretz, Technion – Israel Institute of Technology, Israel, “Sequential Infiltration Synthesis – From Design Rules to New Architectures of Metal Oxide Growth within Polymers”

TF18+EM: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials

  • Sriram Krishnamoorthy, University of Utah, “Metalorganic Vapor-phase Epitaxy of Gallium (Aluminum) Oxide Thin Films and Heterostructures for High Power and High Frequency Electronics”

TF19+2D+MI: Chalcogenide Materials and Applications

TF20+2D+EM: Low Dimensional Materials in Tunnelling Applications

TF21+2D+EM+MI: Thin Films for Quantum Computing

  • Dipanjan Mazumdar, Southern Illinois University, “Physical Properties of Binary Chalcogenide Thin Films Grown by Magnetron Sputtering”

TF22+AP: ALD and CVD for Nanostructured and High Aspect Ratio Materials

  • Neil P. Dasgupta, University of Michigan, Ann Arbor, “Rational Design of Hierarchically-Structured Nanomaterials with Tailored Interfaces Using Atomic Layer Deposition: Bridging Length Scales from Atoms to Bulk”

TF23: Thin Film Poster Session

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Key Dates

Awards Nominations Deadlines:
March 31, 2021
(Student May 3, 2021)

Abstract Submission Deadline:
May 3, 2021

Housing Deadline:
September 30, 2021
(Opens August 2021)

Early Registration Deadline:
October 4, 2021
(Opens August 2021)

Downloads

  • Call for Abstracts Overview (PDF)
  • Copyright Agreement
  • Sponsor Form

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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