Call for Abstracts Deadline: May 3, 2021
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      • EM: Electronic Materials and Photonics
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      • 2D: 2D Materials
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Division: Electronic Materials and Photonics (EM)

The Electronic Materials and Photonics Division welcomes abstract submissions in any aspect of the science and engineering of materials, interfaces, and processing that advance the production and/or fundamental understanding of electronic, photonic, and optoelectronic technologies.  Topics planned for AVS 67 include materials, processes, and devices for advanced logic, memory, and interconnect applications, as well as a session for computational methods to discover new materials and devices. Consistent with the theme of AVS 67, we are devoting sessions to the advances in interfacial science necessary for electronic and photonic devices for energy and the environment.  Topics include, but are not limited to, computational modeling, 2.5D and 3D heterogeneous integration, low-power electronics, power electronics, photovoltaics, and thermoelectrics.  We will also hold a session covering the latest advances in electronic and photonic nanostructure synthesis, assembly, and properties, as well as the techniques required for their characterization on the nanoscale.  As in past years, we will offer graduate student poster awards as well as post-doc travel awards to help create a forum in which younger scientists can present their work and develop relationships for the future.

EM1+BI+NS+PS+TF: Electronic and Photonic Materials and Devices

  • Rehan Kapadia, University of Southern California, “2020 AVS Peter Mark Memorial Award Lecture: Efficient Graphene Hot Electron Devices: Electrochemistry”

EM2+PS+TF: New Devices and Materials for Logic, Memory, and Interconnects

  • Zhiguo Qian, Intel Corporation, “Advanced Packaging Interconnects”
  • Bhadri Varadarajan, Lam Research Corporation, “New Materials Development to Meet Future Integration Needs”

EM3+TF: Wide and Ultra-wide bandgap materials and devices

  • Brianna Klein, Sandia National Laboratories

EM4+BI+MI+MN+NS: Bottom-up Nanostructures

  • Samuel G. Carter, U.S. Naval Research Laboratory, “Epitaxial Quantum Dots for Quantum Science and Technology”
  • Julia Greer, CalTech

EM5+MI: Electronic and Photonic Devices for Energy Conversion and Storage

  • Joshua Choi, University of Virgnia, “Impact of Atomic Structure and Dynamics on Solar Cell Performance of Metal Halide Perovskite Thin Films”
  • Kristopher O. Davis,  University of Central Florida, “Photon Management, Surface Passivation, Carrier Selectivity, and Carrier Transport”
  • Vivian Ferry, University of Minnesota, “Light Management Strategies for Photovoltaic Modules and Luminescent Solar Concentrators”

EM6+MN: 2.5 and 3D Heterogeneous Integration

  • Ravi Mahajan, Intel
  • Jian Shi, Rensselaer Polytechnic Institute, “Remote Epitaxy of Complex Materials”

EM7+PS+TF: Atomic Scale Processing for Devices

  • Ola Nilsen, University of Oslo, Norway, “Building MOFs from the Gas Phase at the Molecular Level – Active Surfaces by Combining Organics with Inorganics”
  • Jin-Seong Park, Hanyang University, South Korea

EM8+TF: Accelerated Materials and Device Discovery: Simulation and Modeling

  • Elif Ertekin, University of Illinois, “Accelerated Discovery of New Thermoelectrics: High-throughput Approach to Dopability Predictions in Diamond like Semiconductors”

EM9: Electronic Materials and Photonics Poster Session

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Key Dates

Awards Nominations Deadlines:
March 31, 2021
(Student May 3, 2021)

Abstract Submission Deadline:
May 3, 2021

Housing Deadline:
September 30, 2021
(Opens August 2021)

Early Registration Deadline:
October 4, 2021
(Opens August 2021)

Downloads

  • Call for Abstracts Overview (PDF)
  • Copyright Agreement
  • Sponsor Form

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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