The MEMS and NEMS Technology Group program will highlight recent advances in broad areas of micro/nanoelectromechanical systems (MEMS/NEMS), especially latest fundamental studies of novel materials, processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas. The AVS67 MN program will include a focus on integration and interface. Specific highlights for AVS67 will be nanotribology and nanomechanics at the interface and MEMS technology for energy and environment. Our program will also include MEMS/NEMS heterogeneous integration, and nanomechanics and optomechanics for quantum computing and sensing. The program continues to embrace latest progress in optical MEMS/ NEMS, micro/nanophotonics, optomechanics, quantum MEMS/ NEMS, resonant systems, CMOS-MEMS, mesoscopic dynamics and dissipation processes, environmental sensors, harsh-environment transducers, and MEMS/NEMS-enabled energy and sensing/imaging technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS for biosensing, bio-inspired microsystems, wearable and wireless healthcare.
MN+AP+BI+EM+NS+PS+SE+TF-FrM: Nanomechanics at Atomically-Flat Surfaces and Interfaces
- Anirudha Sumant, Argonne National Laboratory, “Towards Eliminating Friction and Wear in Micro-Machines to Macroscale Mechanical Systems”
- Juan Xia, University of Electronic Science and Technology of China, “Interlayer Vibration Mechanics in 2D TMDC Revealed by Ultra-low-frequency Raman Spectroscopy”
MN+2D+NS+QS-WeA: MEMS & NEMS Enabled Sensing, Imaging, and Precision Measurement
- Robert Carpick, University of Pennsylvania, “Visualization of Nanoscale Contact by in situ AFM-TEM Experiments: Sliding-Dependent Adhesion of Si, and Wear at the Interface MoS2-MoS2 Interface”
- John Kitching, NIST, “Chip-scale Atomic Devices”
- John Marohn, Cornell University, “Electric Force Microscopy of Photoactive Samples: Achieving Nanosecond Time Resolution Using Phase Kicks and Getting the Tip-Sample Interaction Right Using Lagrangian Mechanics”
- Gregory Whiting, University of Colorado Boulder, “Printed and Biodegradable Sensors for Real-Time High-Spatial Density Monitoring of Soil Conditions”
MN+2D+NS+QS-ThM: Emerging MEMS and NEMS Materials, Devices, and Process
- Roy Olsson, University of Pennsylvania, “Aluminum Scandium Nitride Microdevices for Next Generation Nonvolatile Memory and Microelectromechanical Systems”
- Xu-Qian Zheng, University of Florida, “β-Ga2O3 Resonant Micro/Nanoelectromechanical Systems (M/NEMS)”
MN-On Demand: MEMS and NEMS On Demand Session
MN-ThP: MEMS and NEMS Poster Session