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      • Divisions
        • AS: Applied Surface Science
        • BI: Biomaterial Interfaces
        • EM: Electronic Materials and Photonics
        • MI: Magnetic Interfaces and Nanostructures
        • NS: Nanoscale Science and Technology
        • PS: Plasma Science & Technology
        • SE: Advanced Surface Engineering
        • SS: Surface Science
        • TF: Thin Film
        • VT: Vacuum Technology
      • Focus Topics
        • 2D: 2D Materials
        • AC: Actinides and Rare Earths
        • AP: Atomic Scale Processing
        • CA: Chemical Analysis and Imaging at Interfaces
        • EL: Spectroscopic Ellipsometry
        • HC: Fundamental Discoveries in Heterogeneous Catalysis
        • HI: Advanced Ion Microscopy & Ion Beam Nano-Engineering
        • LD: Leaders in Energy and The Environment
        • LS: New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources
        • QS: Materials and Processes for Quantum Information Science
        • SM: Smart Multifunctional Materials for Nanomedicine
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        • MN: MEMS and NEMS Technology
        • MS: Manufacturing Science and Technology
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Group: MEMS and NEMS Technology (MN)

The MEMS and NEMS Technology Group program will highlight recent advances in broad areas of micro/nanoelectromechanical systems (MEMS/NEMS), especially latest fundamental studies of novel materials, processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas. The AVS67 MN program will include a focus on integration and interface. Specific highlights for AVS67 will be nanotribology and nanomechanics at the interface and MEMS technology for energy and environment. Our program will also include MEMS/NEMS heterogeneous integration, and nanomechanics and optomechanics for quantum computing and sensing. The program continues to embrace latest progress in optical MEMS/ NEMS, micro/nanophotonics, optomechanics, quantum MEMS/ NEMS, resonant systems, CMOS-MEMS, mesoscopic dynamics and dissipation processes, environmental sensors, harsh-environment transducers, and MEMS/NEMS-enabled energy and sensing/imaging technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS for biosensing, bio-inspired microsystems, wearable and wireless healthcare.

MN+AP+BI+EM+NS+PS+SE+TF-FrM: Nanomechanics at Atomically-Flat Surfaces and Interfaces

  • Anirudha Sumant, Argonne National Laboratory, “Towards Eliminating Friction and Wear in Micro-Machines to Macroscale Mechanical Systems”
  • Juan Xia, University of Electronic Science and Technology of China, “Interlayer Vibration Mechanics in 2D TMDC Revealed by Ultra-low-frequency Raman Spectroscopy”

MN+2D+NS+QS-WeA: MEMS & NEMS Enabled Sensing, Imaging, and Precision Measurement

  • Robert Carpick, University of Pennsylvania, “Visualization of Nanoscale Contact by in situ AFM-TEM Experiments: Sliding-Dependent Adhesion of Si, and Wear at the Interface MoS2-MoS2 Interface”
  • John Kitching, NIST, “Chip-scale Atomic Devices”
  • John Marohn, Cornell University, “Electric Force Microscopy of Photoactive Samples: Achieving Nanosecond Time Resolution Using Phase Kicks and Getting the Tip-Sample Interaction Right Using Lagrangian Mechanics”
  • Gregory Whiting, University of Colorado Boulder, “Printed and Biodegradable Sensors for Real-Time High-Spatial Density Monitoring of Soil Conditions”

MN+2D+NS+QS-ThM: Emerging MEMS and NEMS Materials, Devices, and Process

  • Roy Olsson, University of Pennsylvania, “Aluminum Scandium Nitride Microdevices for Next Generation Nonvolatile Memory and Microelectromechanical Systems”
  • Xu-Qian Zheng, University of Florida, “β-Ga2O3 Resonant Micro/Nanoelectromechanical Systems (M/NEMS)”

MN-On Demand: MEMS and NEMS On Demand Session

MN-ThP: MEMS and NEMS Poster Session

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Key Dates

Awards Nominations Deadlines:
March 31, 2021
(Student May 3, 2021)

Abstract Submission Deadline:
June 1, 2021
(Late Breaking August 31, 2021)

Early Registration Deadline:
October 4, 2021

Downloads

  • Copyright Agreement (PDF)
  • Presentation Instructions (PDF)
  • Sponsorship Form (PDF)
  • Technical Program (PDF)
  • Viewing Instructions (PDF)

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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