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      • Divisions
        • AS: Applied Surface Science
        • BI: Biomaterial Interfaces
        • EM: Electronic Materials and Photonics
        • MI: Magnetic Interfaces and Nanostructures
        • NS: Nanoscale Science and Technology
        • PS: Plasma Science & Technology
        • SE: Advanced Surface Engineering
        • SS: Surface Science
        • TF: Thin Film
        • VT: Vacuum Technology
      • Focus Topics
        • 2D: 2D Materials
        • AC: Actinides and Rare Earths
        • AP: Atomic Scale Processing
        • CA: Chemical Analysis and Imaging at Interfaces
        • EL: Spectroscopic Ellipsometry
        • HC: Fundamental Discoveries in Heterogeneous Catalysis
        • HI: Advanced Ion Microscopy & Ion Beam Nano-Engineering
        • LD: Leaders in Energy and The Environment
        • LS: New Trends in Structural Electronic Characterization of Materials, Interfaces, and Surfaces Using Synchrotron and FEL Based Light Sources
        • QS: Materials and Processes for Quantum Information Science
        • SM: Smart Multifunctional Materials for Nanomedicine
      • Groups
        • MN: MEMS and NEMS Technology
        • MS: Manufacturing Science and Technology
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Division: Thin Film (TF)

The Thin Film Division offers several core oral sessions and one poster session. A broad range of outstanding invited speakers will cover the breadth of thin film science, thin film interfaces, technology, and applications. We have several  sessions dedicated to ALD and CVD, encompassing from surface reactions and growth mechanisms to novel processes, precursors, scale up, and emerging applications, and sessions dedicated to novel materials by a wide range of deposition processes, including epitaxial films and interfaces, solution based methods, and the application of simulation and machine learning to thin film growth. Additionally, the division has a strong focus on the application of thin films, including  microelectronics and advanced memory applications, interfaces and contacts, flexible electronics, plasmonic, photonic, and metamaterials, energy, and catalysis. It has also a session dedicated to advances in deposition methods of wide bandgap and ultrawide bandgap materials. This year, the division is also introducing two new sessions on thin films for quantum computing and it also features a session on interfacial phenomena in thin film growth. Finally, the division continues its focus on organic and hybrid materials, including the modification of polymers using vapor infiltration methods and the vapor deposition of functional polymer films. As in past years, we will host a student-focused session to highlight the Harper Award candidates in which the student finalists will present their work in an interactive “TEDTalk” type of forum.

TF+2D+AP+SS-ThA: ALD and CVD: Surface Reactions, Mechanisms, and Precursors

  • Won-Jun Lee, Sejong University, Korea (Republic of), “Virtual Presentation: A Comparative Study on the Heteroleptic Ti Precursors for ALD of TiO2: DFT Calculations and ALD Experiments”

TF+AP-MoA: Molecular Layer Deposition and Hybrid Organic-Inorganic Materials

TF+AP+MN+SS-WeM: Novel ALD and CVD Processes and ALD Manufacturing

  • Mariona Coll, ICMAB-CSIC, Spain, “Free-Standing Nanoengineered Functional Oxides Thin Films”

TF+AP+SS-ThM: Nucleation and Interface Phenomena in Thin Film Deposition and ASD

  • Rong Chen, Huazhong University of Science and Technology, China, “Virtual Presentation: Inherent Selective Atomic Layer Deposition Strategies and its Applications”
  • Vincent Vandalon, Eindhoven University of Technology, Netherlands, “Mechanistic Insight into Atomic Layer Deposition during Initial Growth by In-situ Diagnostics”

TF+PS+SE-TuM: HiPIMS and PVD Thin Films for Emerging and Advanced Materials

  • David Ruzic, University of Illinois at Urbana-Champaign, “2020 AVS Gaede-Langmuir Award Lecture: How Advances in High-Power Magnetron Impulse Sputtering (HiPIMS) Can Control Ion Energy, Ionization, and have High Deposition Rates”

TF+SS-FrM: Epitaxial Thin Films and Interfaces

  • Bharat Jalan, University of Minnesota, USA, “AVS 2021 Peter Mark Memorial Award Lecture: Novel MBE Approaches for Atomically Precise Synthesis of “Stubborn” Metal Oxides”
  • Jason Kawasaki, University of Wisconsin – Madison, “Microscopic Mechanisms and Applications for Remote Epitaxy of Iii-vs and Heusler Compounds”
  • Darrell Schlom, Cornell University, “AVS 2021 John Thornton Memorial Award Lecture: Oxide MBE Rocks! Reflections on 35+ Years of Oxide MBE”

TF+BI+EM-MoM: Vapor Deposition and Vapor Infiltration for Synthesizing Organic-Inorganic Hybrid Thin Films and Interfaces

  • Tamar Segal-Peretz, Technion, Israel, ” Sequential Infiltration Synthesis – From Design Rules to New Architectures of Metal Oxide Growth within Polymers “

TF+BI+EM+MI-MoM: Thin Films for Emergent Applications including Photonics and Plasmonics

  • Mingze He, Vanderbilt University, “Refractive Index Control of Highly Anisotropic 2D Materials”

TF+EM-WeA: Wide and Ultra-Wide Bandgap Thin Films: Advances in Deposition and Novel Materials

  • Sriram Krishnamoorthy, University of California, Santa Barbara, “Metalorganic Vapor-Phase Epitaxy of Gallium (Aluminum) Oxide Thin Films and Heterostructures for High Frequency and Power Electronics”

TF+2D+MI-MoA: Chalcogenide Materials and Applications

  • Aram Amassian, North Carolina State University, “Solution-based Coating of Next Generation Polycrystalline and Monocrystalline Semiconductors”
  • Dipanjan Mazumdar, Southern Illinois University Carbondale, “Physical Properties of Binary Chalcogenide Thin Films Grown by Magnetron Sputtering”

TF+AP-FrM: ALD and CVD for Nanostructured and High Aspect Ratio Materials

  • Neil P. Dasgupta, University of Michigan, Ann Arbor, “Rational Design of Hierarchically-Structured Nanomaterials with Tailored Interfaces Using Atomic Layer Deposition: Bridging Length Scales from Atoms to Bulk”

TF-On Demand: Thin Film On Demand Session

TF-TuP: Thin Film Poster Session

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Key Dates

Awards Nominations Deadlines:
March 31, 2021
(Student May 3, 2021)

Abstract Submission Deadline:
June 1, 2021
(Late Breaking August 31, 2021)

Early Registration Deadline:
October 4, 2021

Downloads

  • Copyright Agreement (PDF)
  • Presentation Instructions (PDF)
  • Sponsorship Form (PDF)
  • Technical Program (PDF)
  • Viewing Instructions (PDF)

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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